Канал: Paul Franzon

How to succeed doing a PhD in Electrical and Computer Engineering

How to succeed doing a PhD in Electrical and Computer Engineering

Implementation of a Chaotic Neural Network Reservoir on a TSV Stacked 3D CyclicNeural Network IC

Implementation of a Chaotic Neural Network Reservoir on a TSV Stacked 3D CyclicNeural Network IC

Design for a 3D Stacked Neural Network Circuit with Cyclic Analog Computing, Koji Kiyoyama

Design for a 3D Stacked Neural Network Circuit with Cyclic Analog Computing, Koji Kiyoyama

Cu-to-Cu Direct Bonding Through Highly Oriented Enlarged Cu Grains for Advanced 3D-LSI Applications

Cu-to-Cu Direct Bonding Through Highly Oriented Enlarged Cu Grains for Advanced 3D-LSI Applications

Proposed Standardization of Chiplet Models for Heterogeneous Integration, Anthony Mastroianni

Proposed Standardization of Chiplet Models for Heterogeneous Integration, Anthony Mastroianni

Thermal Reliability Considerations of Resistive Synaptic Devices for 3D Compute InMemory System Perf

Thermal Reliability Considerations of Resistive Synaptic Devices for 3D Compute InMemory System Perf

Electrical and Performance Advantages of Advanced Monolithic Cooling for 2.5DHeterogeneous ICs

Electrical and Performance Advantages of Advanced Monolithic Cooling for 2.5DHeterogeneous ICs

Multi-ANN Embedded system based on a custom 3D-DRAM, Paul Franzon NCSU

Multi-ANN Embedded system based on a custom 3D-DRAM, Paul Franzon NCSU

3D DRAM Accelerators Review, Prasanth Ravichandiaran, NCSU

3D DRAM Accelerators Review, Prasanth Ravichandiaran, NCSU

Heterogeneous integration: The devil is in the details, invited talk, Alan Huffman, Micross

Heterogeneous integration: The devil is in the details, invited talk, Alan Huffman, Micross

Miniature heterogeneous microLED packages for high performance display systems, Chris Bower Xdisplay

Miniature heterogeneous microLED packages for high performance display systems, Chris Bower Xdisplay

Packaging challenges in 100-300 GHz wireless, invited talk, Mark Rodwell, UCSB

Packaging challenges in 100-300 GHz wireless, invited talk, Mark Rodwell, UCSB

3D IC advanced technologies for smart imager, invited talk, Pascal Vivet, CEA-LIST

3D IC advanced technologies for smart imager, invited talk, Pascal Vivet, CEA-LIST

Hybrid Bonding Technology Enabliing High Performance Computing, Gill Fountain, Xperi

Hybrid Bonding Technology Enabliing High Performance Computing, Gill Fountain, Xperi

3D Integration -- trends, challenges and opportunities, Madhavan Swaminathan, GeorgiaTech

3D Integration -- trends, challenges and opportunities, Madhavan Swaminathan, GeorgiaTech

2.5D and 3DIC Technology and Design, Tutorial, Paul Franzon, NC State University

2.5D and 3DIC Technology and Design, Tutorial, Paul Franzon, NC State University

Advanced Packaging Enablement for Compute, Keynote, Robert Patti, NHanced Semiconductor

Advanced Packaging Enablement for Compute, Keynote, Robert Patti, NHanced Semiconductor

3DIC challenges panel, organized and moderated by Jan Vardaman of Techsearch

3DIC challenges panel, organized and moderated by Jan Vardaman of Techsearch

3D for More Moore, Plenary, Mustafa Badaroglu, Qualcomm

3D for More Moore, Plenary, Mustafa Badaroglu, Qualcomm

Future Challenges for on package interconnects, Plenary, Debendra Das Sharma, Intel

Future Challenges for on package interconnects, Plenary, Debendra Das Sharma, Intel

Introduction2v2

Introduction2v2

Introduction1v2

Introduction1v2

Revision

Revision

Reset

Reset

Do a PhD in ECE at NC State University

Do a PhD in ECE at NC State University

Digital Logic Basics Review - 3. Computer Arithmetic

Digital Logic Basics Review - 3. Computer Arithmetic

Digital Logic Basics Review - Sequential Logic

Digital Logic Basics Review - Sequential Logic

Digital Logic Basics Review 1. Combinational Logic

Digital Logic Basics Review 1. Combinational Logic

Doing an MS degree in Electrical and Computer Engineering at NC State University

Doing an MS degree in Electrical and Computer Engineering at NC State University

Why go to Grad School in Electrical Engineering or Computer Engineering

Why go to Grad School in Electrical Engineering or Computer Engineering

Why go to Grad School in Electrical and/or Computer Engineering

Why go to Grad School in Electrical and/or Computer Engineering

ClockDomainCrossing

ClockDomainCrossing

ASICstyleAdd

ASICstyleAdd

ITRSupdate2015

ITRSupdate2015

ECE520intro2015

ECE520intro2015

Bandit Flight Team - Durham Bulls Opening

Bandit Flight Team - Durham Bulls Opening

complexity4 parameterization

complexity4 parameterization

MoodleWorkshopModule

MoodleWorkshopModule

3DIC Design Stryles - presented at ISCAS2013

3DIC Design Stryles - presented at ISCAS2013

Basics on camtasia

Basics on camtasia

Moodle faculty overview

Moodle faculty overview

introduction2

introduction2

introduction1

introduction1

ASIC Design Course Welcome

ASIC Design Course Welcome

Verilog Basics

Verilog Basics

Open Online ASIC Course

Open Online ASIC Course