This wafer handling module receives a wafer from a robot (not shown in video), flips it 180 degrees, and presents back to robot for pickup. The handoff is failsafe as is the rotation. The module would typically be used in applications where a wafer needs to be flipped upside down for the next processing step, such as bonding or backside metrology.
![](https://s2.save4k.ru/pic/0WTK-U_eHlE/maxresdefault.jpg)