ONYX™ is a Direct Metallization System for High Reliability and Complex Printed Circuit Boards
During this video we will walk you through the ONYX™ Direct Metallization Process by RBP Chemical Technology.
The RBP ONYX™ Direct Metallization Process is an integrated system based on a highly conductive form of finely dispersed graphite. Extensively tested and validated, the ONYX™ Process has proven to be versatile and cost effective. Currently the customer base using ONYX™ processes flex, rigid-flex, HDI and high aspect ratio multilayer printed circuit boards with ease and cost effectiveness when compared to conventional electroless copper. The ONYX™ process easily surpasses industry reliability standards including IST (interconnection stress test) and ATC (accelerated thermal cycling).
Key Advantages of Onyx
• Less expensive than conventional electroless copper
• Smaller equipment footprint compared to electroless copper
• Able to successfully metalize literally all resin materials used in PWB fabrication
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