"Intel® Core™ Ultra mobile processors, codename Meteor Lake represent Intel's biggest shift in client SoC architecture in 40 years!
In Architecture All Access Season 3, Episode 5, Pat Stover, Vice President in Technology Development at Intel, walks us through an all-access look into the innovative advanced packaging technologies Intel developed for Meteor Lake. Packaging once just connected power and signaling but advanced packaging opens new opportunities for chip design, transitioning us from a system-on-chip to system-on-package. In Meteor Lake, high bandwidth interfaces are pivotal. That makes Foveros 3D Packaging Technology the perfect match. With its low power, low latency, and high interconect density, it unlocks new levels of scalability, allowing us to select the best transistors for specific tasks across different tiles. Pat unpacks the details of Foveros as well as the process for assembling Meteor Lake.
Architecture All Access is a master class technology series, featuring Senior Intel Technical Leaders taking an educational approach in explaining the historical impact and future innovations in their technical domains.
Watch Season 3 intro video here: [ Ссылка ]
Watch Season 3 Episode 1: Meteor Lake Architecture Overview here: [ Ссылка ]
Watch Season 3 Episode 2: Meteor Lake 3D Performance Hybrid Architecture & Intel Thread Director here: [ Ссылка ]
Watch Season 3 Episode 3: Meteor Lake GPU Architecture here: [ Ссылка ]
Watch Season 3 Episode 4: Meteor Lake Artificial Intelligence here: [ Ссылка ]
00:00 Introduction
00:14 Meet Pat Stover, Intel VP of Technology Development
01:01 The need for advanced packaging
01:35 Transitioning to System on a Package
01:59 OPIO with Haswell in 2013
02:13 EMIB with Stratix 10 in 2017
02:37 Foveros with Lakefield in 2020
02:48 Co-EMIB with Ponte Vecchio in 2022
03:13 Foveros 3D Packaging in Meteor Lake
04:27 Foveros base tile characteristics
05:09 Assembling Meteor Lake
06:33 Wrapping up
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