Ever wondered how double-sided printed circuit board assemblies are manufactured? Normally the first side is completed using the normal SMT (surface mount technology) process including robotic pick-and-place and solder reflow. How we do the second side depends on many factors. These include the board layout, the size (or mass) and type of components, the production volume, and the manufacturing tools available. So the second side might be soldered using the reflow oven, the wave solder, selective soldering, robotic soldering or hand soldering. Learn more about how we use these different techniques at our PCBA manufacturing center in the USA.
