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Traditional Interconnects for RF applications over 30 GHz introduce impedance mismatch resulting in signal loss through board-to-chip transitions. Printed 3D interconnects made with Aerosol Jet provide a significant benefit to bond wires and ribbons because they are shorter and lower profile. Also, the interconnect can be shaped to any profile and thickness can be tailored. All of this leads to significant improvements in RF loss, reductions of up to 50% have been observed at frequencies over 60 GHz.
