The FISCHERSCOPE® X-RAY XDV-μ series is designed for precise coating thickness measurement and material analysis on very delicate structures. All devices are equipped with polycapillary optics that focus the X-ray beam, making measuring spots (fwhm) with diameters between 10 and 60 μm possible. The high intensity of the focused radiation results in a short measuring duration.

Besides the universally applicable XDV-μ, specialized devices are also available for the electronics and semiconductor industries. For example, the XDV-μ LD is optimized for measuring on printed circuit boards, while the XDV-μ Wafer is intended for use in clean rooms.

All mentioned functionalities are also included in the new generation of our FISCHERSCOPE® X-RAY XDV® series. 💯 The XDV® instruments are now available in a new design and are equipped with the new DPP+ digital pulse processor for up to 50% improved performance. Benefit from a substantial optimization of the measuring accuracy 🎯 or a significant reduction of the measuring time. ⌚

More about our FISCHERSCOPE® X-RAY XDV®-µ: [ Ссылка ] 📍

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