Wafer inspection stages, or motion systems, are designed for high precision and high performance. Throughput is one of the main goals to boost the performance of wafer inspection stages in the semiconductor industry for microelectronics.
This video shows the next-generation XY2Z-Theta wafer inspection system which is used during inspection of 8" and 12"' wafers. Compared to the conventional stacked stages this motion system has a very flat architecture. The X-axis, which consists of two parallel mounted linear guideways, is mounted on a solid granite base. Between the two linear guides for the X-axis, a compact module, lightweight aluminum design, is mounted which include the Y-axis. Within the Y-axis the Double Z- Theta module is mounted. This design is inspired by in-house developed topology optimization software.
The integrated design of the wafer inspection stage has inherent advantages compared to conventionally stacked systems (linear stages stacked on each other). The dynamic performance of the inspection stage is improved and Abbe errors are reduced. As dynamics (acceleration/speed) and precision are improved it offers advantages for improving customer wafer throughput.
Application examples are:
Optical wafer defect inspection
Critical dimensions wafer inspection
Thin film metrology
Wafer scribing
Wafer overlay inspection
MEMS inspection
2D/3D wafer inspection
Hybrid bonding
Flip chip die bonding
This video gives an inside view of our positioning system engineering group. Design examples of modules that are used in wafer inspection stages are on the screens. Technicians are assembling a motion stage for use in a wafer inspection system. Finally, all axes are moving including the Z-axis from wafer loading and unloading. At the end of the video, an example of microelectronics is shown with electric-driven vehicles
More information about wafer inspection stages: [ Ссылка ]
To watch more videos about applications visit [ Ссылка ]
To contact us, send an email to info@PM.nl
