Momentive’s liquid-dispensed thermal management materials can be precisely applied wherever they are needed to help remove heat from critical chips and components in automotive electronics or e-mobility applications. This video illustrates the application of Momentive's SilCool TIA268GF thermal gap filler, demonstrated on automated PVA dispensing equipment.
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Learn more about Momentive's wide portfolio of Silicone solutions below:
Silicones for Automotive Applications: [ Ссылка ]
Thermal Management for Automotive Electronics: [ Ссылка ]
Thermally conductive gap fillers: [ Ссылка ]
Ultra-high thermal gap fillers: [ Ссылка ]
Thermally conductive pottings and encapsulants: [ Ссылка ]
