#semiconductor #wafer #grinder can be used to quickly thin the product, improve the surface quality of the product, and increase the flatness and parallelism,and can effectively control the thickness, can achieve a higher thickness tolerance.
#grindingmachine Applies to:
• Semiconductor wafer grinding or back-thinning of advanced materials, such as:
SiC,GaAs,Sapphire,Si,GaN,InP.
• Ultra-precision optical components, such as：
ULE glass,High-energy particle scintillator,Fluorescent film,Projection glass.
• Ceramic substrate, such as：
Al2O3, AlN, CaF2,ZnSe,carbide,ZrO₂, BaTiO3, SrTiO3, PbTiO3, LiNbO3, CdTe,CdS, Ca2Sx, Al2O3CrNd, etc.
• semiconductor advanced packaging, such as :
ceramic, polyimide,Resin material.
E-Mail:grace@lapping-machine.com

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