In today's video I'm going to process BGA IC chips from computer motherboards , tv , and graphic cards.
With the great yield of 10 g gold per kg materials.
In first place i leached solder with nitric acid , Tin converts to Metastannic acid which i use it later to recover tin from.
Then i did wet ashing process using sulfuric acid to open ic chips packages.
after that gold bond wires became evident .
After that base metals dissolved with nitric acid (copper was dominant metal)
afterwards gold wires dissolved using aqua regia.
To expel nitric acid i used sulfamic acid then i dropped gold with ferrous sulfate (FeSO4) .
gold percipitate washed in hot HCl and melted.
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