Mobile World Congress 2018:
Introducing the latest 3D Time-of-Flight imager for mobile devices from Infineon and pmdtechnologies. And the world’s smallest 3D Time-of-Flight module, developed by pmd, has become even smaller – and better!
Featuring the new, smaller imager, integrated eye-safety features, a reduced PCB area and component count, SPI flash support and an optimized illumination concept with bare die VCSEL.

- World’s smallest form factor
- Sunlight robust
- Minimal power consumption
- Proven in mass production
- Easy design-in
- Fast once-a-lifetime calibration
- BoM cost-optimized

It fits perfectly into today’s smartphones top bezel and unlocks a completely new level of applications for user experience.
From secure 3D face unlock, face tracking and avatar animation to selfie background removal.
On the world-facing side, the depth camera sets new standards for high sophisticated augmented reality, accurate 3D scanning and environmental monitoring.

Welcome to state-of-the-art 3D depth sensing, jointly developed by Infineon and pmdtechnologies!

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