In this video I show you the process to reball the interposer / sandwich of an iPhone 13 Pro motherboard. I tend to make a lot of on the fly decisions and sometimes want to try new techniques. I had never tried to heat the reball stencil this way before but I actually think I prefer this method now. The heating platform might not be necessary, but the no nozzle hot air while spreading the heat seemed to work well. One of the reasons I like this work is because there are no rules except to provide quality work. I am free to arrive there using any methods I like.

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