MicroLED laser debonding and selective transfer process. Micro LED wafers of different colours are loaded in cassettes. The machine debonds the LEDs from the wafer and are transferred to carriers. The precise delivery of the laser beam to the correct devices is achieved by an inline high magnification vision system coupled to the laser optics. Selective transfer is done by a sequence of partial transfers. This is made possible by targeted debonding of columns of microLEDs. The motion stages are accurate to 1um to ensure correct positioning of the micro LEDs.
