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ST’s L6360 and L6362A enable a master and device solution for IO-Link and general-purpose (SIO-mode) transceivers via a single 3-wire connection (PHY2) supporting COM1 (4.8 kbaud), COM2 (38.4 kbaud) and COM3 (230.4 kbaud) modes.
The half-bridge output stages can be configured as high-side, low-side or push-pull for maximum design flexibility. The two ICs meet all the remote service, standardization, functionality verification, diagnostics and monitoring requirements of the latest sensors and actuators and are suitable for all automation systems. They represent a compact, efficient and robust solution for the Smart industry (Industry 4.0 revolution).
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