In this video I show how I go about removing and replacing a BGA. Like I say in the video multiple times, our X-ray machine is out of order. I know that all solder balls in the grid are liquified by gently tapping or nudging the component slightly off pad and observe how quickly the component snaps back into place or on pad due to the liquified solder surface tension between the balls and pads. And lastly, I run the board through In circuit Test to ensure full functionality. I will most likely scrap this circuit board due to the slight discoloration of the solder mask that occurred. I apologize for the occasional out of focus.

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