Learn how our laser technologies enable the manufacturing of next-gen microLED displays. Excimer lasers are key to performing the three vital processes in microLED fabrication – Laser Lift-Off (LLO), Laser-Induced Forward Transfer (LIFT), and Repair/Trimming while high-power infrared diode lasers are the perfect bonding solution and electrically connecting the dies to the substrate.
Discover how laser-assisted bonding bypasses one of the remaining roadblocks in volume microLED display production. [ Ссылка ]
Chapters:
00:00 Introduction
00:30 Laser-Lift Off - Release from the EPI-Wafer
01:15 LIFT - Laser-Induced Forward Transfer
02:02 Repair/Trimming - Remove and Refill
02:21 LAB - Laser-Assisted Bonding
#microled
#display
#laser
