I purchased this wafer from Ebay and it arrived well packaged, which is good because this wafer is even more fragile than most. That is because this wafer has been through a process in silicon wafer manufacturing known as “Backgrinding”.
-
This process grinds away the backside of the wafer until the desired thickness is reached. You can generally tell this has been done based on the pattern on the back of the wafer. Looking at sources on the internet, typical wafers may be around 750μm thick, whereas a ground wafer would be about 1/10th of that (50-75μm). I seem to have misplaced my caliper, otherwise I would get the exact thickness of this wafer.
-
As I mentioned earlier, the integrated circuit on this wafer is made by AMD. While there are many numbers on the wafer, none of them seemed to reveal what this chip’s function is. Among these numbers are 77184F on the chip, and 77220E at the top of the wafer. There are also four sets of initials near the AMD text, which are: ED, GS, KM, and JS.
