In March 2021, Bryan Germann gave a great presentation looking at the use of aerosol printing in the electronic packaging industry. In particular, he showcased how aerosol printing can replace wire bonds and other interconnects, creating shorter signals paths over non-flat 3D areas, and thus boosting high-frequency performance. He also showcased how aerosol printing could create custom interconnect shapes, for example, improving impedance matching without the need for built-in compensation circuits.
In general, the use of printed electronics in electronic packaging is growing. Applications include interconnects, package-level area-selective EMI shielding, die-attach, micro bumping, and even RDL prototyping.
Join us on 9-10 March 2022 for our next event on Printed, Hybrid, InMold, and 3D Electronics to hear the latest. Learn more on www.TechBlick.com
Shayna Watson David Sessoms Kyle Homan Bryan Germann
#electronicmanufacturing #electronicpackaging #osat #interconnect #printedelectronics #aerosol #5gtechnology #5g #SiP #finelineprinting
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