ADLINK’s COM-HPC-sIDH COM-HPC Server Type Size D module is based on the Intel® Xeon® D-2700 processor and features integrated high-speed Ethernet for up to 8x 10G or 4x 25G combined with 32 PCIe Gen4 and 16 PCIe Gen3 lanes for instantaneous responsiveness and performance. Equipped with Intel® TCC, Deep Learning Boost (VNNI), and AVX-512 technologies for optimal, accelerated AI performance, and support for Time Sensitive Networking (TSN), it offers precise control for hard-real-time workloads across all networked devices.
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The platform includes integrated hardware acceleration for deep learning inference—Intel® Deep Learning Boost (Intel® DL Boost). Intel DL Boost combines three Intel® Advanced Vector Extensions (Intel® AVX) instructions into one, which speeds processing of int8 workloads. To take advantage of Intel DL Boost, use the Intel® Distribution of OpenVINO™ toolkit to tune and optimize deep learning models.

Built for edge and rugged AI applications, this new ADLINK COM with Intel® Xeon® D-2700 (formerly known Ice Lake-D) empowers system integrators to realize all of their IoT innovations, from unmanned aerial vehicles, autonomous driving, robotic surgery, to rugged HPC servers, 5G applications, automatic drilling, ship management, and more.

For more information about our COM-HPC Server Type embedded modules, please visit:
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