Semi-conductive silicon wafer grinding and processing
A wafer is a thin slice of semiconductor material used to fabricate integrated circuits or other microdevices1. Also called a slice or substrate, wafers must undergo a number of steps in the preparation process before they are ready for use.

Manufacturing processes for silicon semiconductor
Silicon Ingot ⇒ Cropping(electroplated bandsaw) ⇒ Cylindrical / Flat Grinding Silicon Rod ⇒ Ingot Silicon (diamond wire) ⇒ Lapping (double side wheel/polishing pad) ⇒ Edge Grinding ⇒ Surface grinding ⇒ polishing⇒ wafer⇒ patterning ⇒ back grinding (vitrified / resin wheels) ⇒ dicing (dicing blades)⇒ chips ⇒ molding ⇒ packaging

More Superhard provides diamond tools for the semiconductor industry including
► Diamond Bandsaw Blades
Cutting silicon ingot in semiconductor industry. Thery are also cut sapphire ingot , quartz glass, etc
Edge shapes diamond bandsaw blades: continuous, segmented ( half moon) and serrated shape

► Cylindical / Surface Grinding Wheels
Peripheral grinding of silicon ingots, or processing the outer surface of silicon ingots and to make orientation flat

► Edge Grinding Wheel
Edge wheel/ chamfering wheels for silicon and sapphire wafer edge grinding. A small diamterer wheel for notch grinding

► Dicing Blades ( Hub type and Hubless type)
Ultra - thin diamond dicing blade ( hub type and hubless type) for scribing silicon wafers, compound semiconductor wafers (GaAs, Gap)

► PU Polishing Pad
Polishing and finishing of glass, LCD/LED substrates, precision optics, hard disk, metal and semiconductor wafer surfaces

Moresuperhard can provide you series of cutting, dicing, grinding and polishing solutions. If need feel free to contact julia@moresuperhard.com or whatsapp:+8615093391569

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