The trend to miniaturize wireless communication devices has led to decreased PCB sizes and increased component densities. Although this shift to miniaturized technology has aided many areas of electronic design, it constrains RF front-end design. Multilayer chip antennas are an interesting choice for engineers, who are restricted by cost and space requirements in wireless system design. Low temperature co-fired ceramic (LTCC) multilayer chip antennas are formed from several layers of dielectric material, which are pressed and fired together into a monolithic structure.
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