Hello, friends @MakeGold
Today I will introduce the method of silver recovery from IC bga chips
lead-free solder is mostly silver, tin, and sometimes copper or other metals. The temperature required to get a lead-free solder alloy into its molten Pb-free solder materials are used in various parts of interconnections in electronic packages. The first-level interconnectis between the chip and the package substrate and lead-free solder bump material are used in the case of a Flip Chip BGA (FCBGA).
solder ball Where we are interested and there is a silver mixed.
Use nitric acid mixed with water to dissolve the solder ball.
Using copper to precipitate silver.
Use hot water to clean the silver silt powder.
Dry the silver silt powder.
Melt the silver silt powder.
Sprinkle a little borax powder.
silver recovery from IC bga chips "How to make silver"

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