DMG MORI supports industries with specific requirements with tailor-made technology solutions. As a key sector for digitalization, DMG MORI offers the semiconductor industry the right machine concepts for the production of high-precision components made of advanced materials for semiconductor manufacturing. In the Semiconductor Excellence Centre, DMG MORI ULTRASONIC develops groundbreaking process solutions for machining the most demanding components made of technical glasses and ceramics in the semiconductor industry.
By superimposing an ultrasonic vibration with amplitudes in the range of 5-15µm on the rotating grinding tool, a reduction in process forces of up to 50 percent is achieved during machining. Depending on the requirements, feed rates and infeeds can be increased, surface quality improved and tool wear minimized. Micro-cracks in the material, known as SSD (sub-surface damage), are reduced to a minimum.
Applications range from fused silica rings for use in process chambers of wafer etch systems, to ceramic frame components and mounts for lithography equipment, to Zerodur mirror substrates or SiC wafer chucks. Even drilling thousands of holes in “shower heads” with drill diameters of less than 0.5 mm is no challenge for ULTRASONIC technology.
⭐Follow us⭐
➡ Facebook: [ Ссылка ]
➡ Instagram: [ Ссылка ]
➡ LinkedIn: [ Ссылка ]
➡ Twitter: [ Ссылка ]
➡ Website: [ Ссылка ]
➡ DMG MORI Events: [ Ссылка ]
#dmgmori #semiconductorexcellence #ultrasonicmachines #ultrasonic50 #microdrilling
