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Ultra high speed mass transfer micro LED chips on SQRP (Release Plate) to SQRP-G (Large Size Donor Plate)
Micro LED Transfer Parts in this Video : SQDP-G Series (Large Size Donor Plate), SQRP Series (Release Plate)
0:00 Title
0:18 Ultra high speed mass transfer transferring Red, Green and Blue Micro LED chips
1:32 Micro LED Chip Transfer to SQDP-G (Large Size Donor Plate) Completed
About Shin-Etsu Micro LED Process Technology :
Micro LED display is regarded as the most promising candidate for next-generation display, however high manufacturing cost is major hurdle for the mass production due to difficulty to handle extremely small LED chips.
Improvement of complexity and low yield of Micro LED chip manufacturing and transferring process is the key for mass production, and we have utilized and developed our technology to solve these problems.
Laser Lift Off/LLO is a process to peel off and transfer micro LED chips to receptor board by irradiating excimer laser from the back side of the micro LED wafer or transfer parts on which chips are arrayed.
Shin-Etsu Group provides transfer equipment and parts suitable both for Contact-LLO (transfer micro LED chips to transfer parts with contact) and for Gap-LLO (transfer micro LED chips to transfer parts without contact).
We can provide transfer process suitable for various applications (TV, smart watch, etc).
For more information, please visit Shin-Etsu micro LED process technology website.
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