Visit: [ Ссылка ]. The Model 830 is a general purpose pick and place system for die and surface mount components. The 830 offers manually or pneumatically controlled Z motion with semiautomatic vacuum pickup tool movement for transferring die and other small devices from tape or carrier trays to packages. A footswitch option controls the pick - up head to lower the pickup tool to working height and return it home. Open frame design assures full visiblilty and complete access of all system components. Operator friendly - takes less than two minutes to learn to operate. Epoxy die bonding capability can be easily added. The 830 works with any tape - mounted die removal system, including S.E.C.'s Model 4800 heated tape expanding die ejector grid featuring a grid plate that can be machined with one of two different pyramid pitches.
The Model 830 Die Inspection Station version is used to pick die, visually inspect them and place them into a waffle pack or submount. Inspection and picking can be done conveniently in one process with one system.
