This video shows the recovery of gold from BGA chips harvested from RAM modules.
There are two parts left out of this video -
The chips were soaked in warm concentrated HCl for a few hours after removal from the boards. This dissolves the tin used in the solder. This is an important step and should not be omitted!
The melting of the gold button was not shown, but I have another video showing the melt process.
The video is long because the process is long.
Please pay special attention to safety procedures and equipment used in every step. Failure to wear adequate safety equipment is almost certain to end with you burned (heat and acid) as well as being blind and likely have permanent lung damage!!!!
