ceramic bonding tool is used as a wire bonding tool in the wire bonding process, and can be used for bonding and packaging of thyristor, surface acoustic wave, LED, diode, triode, IC chip and other circuits.
Grinding ceramic bonding tools requires the use of high-rigidity CNC grinders and appropriate diamond grinding wheels. Resin bonds are suitable for precision grinding and polishing, while metal bonds are suitable for rough grinding. By precisely controlling the cutting speed, feed speed and grinding depth, combined with adequate cooling and lubrication, the grinding efficiency can be effectively improved and the surface quality and dimensional accuracy of the ceramic bonding caplliary can be ensured.
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