More tests with the BGA Re-work solution.
Based around the modified REX C100 controller.
A much bigger board this time with plenty of heat sinks and metal work to suck the heat away.
The QFP came off cleanly but foil should have been used to cover vulnerable plastic and other components, like the SMD caps.
Using the correct QFP hot air nozzle would also be best.
Apart from my losing my mind at the 120 degs region and trying to move the IC there were no particular issues but do remember to tape up any vulnerable areas with foil tape!!!
Try to leave an air gap between the plastic and the foil tape. My theory is the tape will reflect and the small air gap might buffer the plastic a little from the foil tapes temperature.
But let me know what you think.............
Too much waffle and not enough concentration on this one. :D
