After my RTX 3090 Kingpin got damaged in my recent LN2 session I sent the card back to EVGA in Taiwan for inspection and repairs to see what happened to the card. It seems I ran the card on LN2 with relatively bad contact on the GPU VRMs that caused some of the mosfets at the center to overheat and get damaged over time.
EVGA made a small "mistake" with the heatsink design, which you should be aware of if you are getting this graphics card model and plan to try it on subzero cooling. The card uses standard thermal pads between the mosfets and the heatsinks, and quite uncommon and very thick thermal interface material, or some kind of thermal paste between the chokes and the heatsinks. The gap between the chokes and the heatsinks is very small, so you should NOT use a thermal pad between the chokes and the heatsinks as it can cause bad contact on some of the mosfets if the pad is too thick. The thermal interface material is very stiffy and it easily looks a bit bad once you remove the heatsinks for the first time. EVGA should have made the gap a little bit bigger and used a proper thermal pad on top of the chokes like before.
On the video we take a short overview of the PCB structure and go through my own experiences and tips to get the card running well for record scores as I already made three top scores with the same graphics card as on the video. Buildzoid said he is working on a very in-depth video of the VRM and PCB design of the RTX 3090 Kingpin, so stay tuned for his video once it is up.
Thanks for watching!
Be sure to watch my recent LN2 Overclocking videos as well with the same card!
#RTX3090 #Kingpin #PCRepair
Product page: [ Ссылка ]
Kingpin Cooling Extreme Cooling gear and KPx thermal paste: [ Ссылка ]
