LFPAK is a clip based package technology released by Nexperia in 2002. LFPAK was designed with reliability and performance in mind due to the harsh conditions of the product lifecycle, the high reliability automotive standards and the increasing demand for high power density. Join Stein Nesbakk as he shows just how much LFPAK can handle.
For more information visit nexperia.com/promotions/20-years-of-lfpak
Conducting 500A in LFPAK
Теги
LFPAKLFPAK56LFPAK33LFPAK56DLFPAK88NexperiaNexperia shortsAOIBLRboard level reliabilityStein NesbakkWhat is LFPAKlead free packageMOSFETsMOSFET qualitywire bonded MOSFETsCopper clip packagingtemperature cyclingAEC-Q101thermal handlingRthD2PAKDPAKPower densitySilicon packagingcurrent ratingcurrent density