Presented by Anthony Yu, VP Computing and Wired Infrastructure, GlobalFoundries.
As traditional chip scaling becomes less practical, the future of silicon photonics (SiPh) shines bright. SiPh's bandwidth, reach, and power advantages are widely adopted for pluggable optics and now extend to ML/AI computing systems through co-packaged optics (CPO). CPO offers cost and power savings in ASIC, packaging, multi-wavelength light sources, assembly, and photonics. This presentation will explore the broader adoption of SiPh through an approach of integrating complex CMOS and optical component functionality onto a single photonic integrated circuit (PIC).
The Linley Spring Processor Conference featured technical presentations on chips and IP for AI applications, embedded, data center, automotive, IoT, and communications. The conference also covered new CPU architectures, networking, memory, security, SoC design, AI training, and other processor-related topics.
For more info on the Linley Spring Processor Conference 2021 you can visit our proceedings page:
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